| Technologies: |
- Single-sided
and double-sided (rigid)
- Multi-layer
up to 20 layers (rigid)
- Blind and
buried vias
- Controlled
impedance
- Controlled
depth drilling
- HDI technology
- TDR testing
- Electroless
nickel/gold, white tin, silver
- OSP, HASL,
and SMOBC finishes
|
|
| Manufacturing
Specifications: |
| IPC-600
Class 2 |
Standard
manufacturing specifications |
| IPC-600
Class 3 |
Available as required |
| IPC-6012/
MIL-PRF-31032 |
Available as
required with in-house testing capabilities
|
|
| Materials
Used: |
- FR-4 (high
Tg)
- FR-5
- CEM-1
- CEM-3
- Getek
- Polyimide
- Teflon (high
frequency)
- Microwave / high
frequency (Rogers 4003 type)
- Cyanate ester
- Ceramic filled
dielectrics
- Mixed dielectric
constructions available as required
- Bergquist
|
|
| Imaging: |
|
Inner layer
pads
|
.025" oversize
minimum
.
|
| Smallest
finished via |
.004" |
| Standard
pad size (.002" annular ring) |
.0085"
annular ring (.017" oversize) |
| Smallest
pad size (.001" annular ring) |
.0075"
annular ring (.015" oversize) |
| Standard
line and spacing |
.004"
/ .004" |
| Special
line and spacing |
.002"
/ .002" |
|
| Drilling: |
| Plated
holes, standard tolerance |
± .003"
|
| Plated
holes, limited tolerance |
±
.002" |
| Non-plated
holes |
±
.002" |
| Recommended
Aspect Ratio |
5:1(drill
diameter : material thickness) |
| Limited
Aspect Ratio |
10:1 |
| Blind
via typical size |
.004"
- .012" finished |
| Blind
via aspect ratio |
0.7:1
(drill depth:drill diameter) |
|
| Multi-layer
Pressing: |
| Customer
designs built with symmetric construction is preferred. |
| Inner
layer core thicknesses |
.002" -
.062"
|
| Lamination |
Vacuum/pressure |
| Panel
size |
18"
x 24" |
|
| Plating: |
| Minimum
copper plating in holes |
.001"
|
| Solder
coat over bare copper |
coverage
and solderable per J-STD-003 |
| Immersion
tin |
.000015"
- .000035" tin |
| Immersion
silver |
.000003"
- .000008" silver |
| Electroless
nicke / Immersion gold |
.000003"
- .000010" gold |
| Tab
gold |
.000025"
- .000030" gold |
|
| Soldermask/Carbon
Inks: |
| Standard
LPI |
.005" annular
ring (.010" oversize)
|
| Minimum
LPI |
.0025"
annular ring (.005" oversize) |
| Soldermask
"dam" between SM pads |
.004"
minimum |
| Ink
types |
Matte,
gloss, semi-gloss |
| Colors |
Green
(standard), other colors as required |
| Thermal
and UV inks |
Available
as required |
| Plugged
via |
Available
if necessary |
| Carbon
Ink |
30
ohms per square unit |
|
| Silkscreen: |
|
|
Thermal and
UV
White (standard), most other colors available as required
|
|
| Routing: |
| Standard
Tolerance Range |
± .005"
- .010"
|
| Limited
Tolerance |
± .003"
|
| Countersinking
/ counterboring |
Sizes as required
|
|
| Scoring: |
| Web
range |
.012" -
.020"
|
| Web
tolerance |
±
.003" |
| Web
angle |
30
degrees, other angles available as required |
| Jump
(skip) score |
available
as required |
|
| Testing: |
| Single/Double
side access testing |
Up
to 17.5" x 11.0" test area |
| Flying
probe |
18.0" x
24.0" test area
|
| TDR |
Coupon, board
testing available as required
|
|
| Cleanliness: |
| Ionic
cleanliness |
2 mgrams Cl/in2 per IPC-TM-650 (2.3.28)
|
|
| Chemical
Testing and Analysis (in-house): |
- Cross sections
(x-sections)
- Thermal stress
analysis
- Solderability
- Hi-Potential testing
- X-ray fluorescence
- Ultraviolet
and visible spectroscopy
- Metallurgical
analysis
- Backlight
analysis
- Multi-layer
delamination analysis
- Waste treatment
analysis
- Coupon testing
(including Group A)
- NIST traceable
- ION Chromatography
|
|
| Value
Added Services: |
The
following FREE services are provided for ALL customers on ALL new
jobs:
|
| Automated
design review check (DRC)
using Genesis 2000 software |
| Engineering
review |
|
|
Chemical
engineering review and testing
Micro-section, ionic cleanliness and other surface contaminant analysis
|
| Vacuum
packaged with dessicant |
|
|
|
| Data
Types and File Formats Supported: |
| Gerber |
gbr (274X preferred,
274D supported)
|
| Autocad |
.dwg,
.dxf |
| Hewlett-Packard |
.hpgl |
| Excellon |
.drl |
| International
graphics |
.iges |
| Genesis |
ODB++ |
| Mentor
Neutral |
mnfv* |
| IPC-D-356A |
.ipc |
| Manual
tape ups |
scanning
conversions to .gbr available as required |
|
| Data
Transmission: |
| Disk |
3.5" floppy
or CD ROM
|
| Modem
(28800 baud) |
317-298-2063
or 317-298-2060 |
| e-mail
|
rapid@rapidproto.com |
|
| Certifications: |
| UL-94-V-0
listed |
E74609
|
| FDA
registered |
#1833978 |
| ISO
9002 |
certified
since 1994 |
| ISO/TS 16949:2002 |
renewed 2004 |
| TL
9000 |
certified
since 2001 |
| MIL-PRF-55110 |
superceded
by MIL-PRF-31032 |
| MIL-PRF-31032 |
certified
since 2000 |
| Automotive
Underhood |
qualified
supplier |
|
| Technology
Roadmap: |
- Laser drilling
- Advanced
HDI technology
- Buried passives
- SEM/EDS -
Scanning Electron Microscope/Energy Dispersion Scanning
|
|
