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Product Feature |
Present |
Future |
| Minimum trace and space width (inner layer / outer layer) | 2 mil / 3 mil | 2 mil / 3 mil |
| Minimum drilled via size | 8 mil | 6 mil |
| Pad over finished hole (IPC-6012 Class 3 annular ring) | 15 mil | 15 mil |
| Pad over finished hole (IPC-6012 Class 2 annular ring) | 10 mil | 10 mil |
| Antipad over finished hole sizes | 20 mil | 15 mil |
| Blind microvias (finished) | 4 mil | 4 mil |
| Pad over microvia size | 10 mil | 10 mil |
| Maximum layers of microvia (stacked, sequentially laminated) | 2 ea | 2 ea |
| Maximum aspect ratio | 15 to 1 | 15 to 1 |
| Sequentially laminated blind via | 5 mil | 5 mil |
| Plated hole size tolerance | +/- 2 mil | +/- 2 mil |
| Soldermask registration | +/- 3.0 mil | +/- 2 mil |
| Maximum layer count | 24 layers | 32+ layers |
| Minimum material thickness (signal / plane / buried via) | 2.9 mil | 2.9 mil |
| Maximum core thickness | 43 mil | 44 mil |
| Impedance control (single-ended & differential) | +/- 7.5 % | +/- 5 % |
| Board thickness min / max (Note: UL min is 15 mil) | 7 / 250 mil | 7 / 250 mil |
| Maximum panel size | 18 x 24 in | 24 x 30 in |
| Maximum copper weight (per side) | 10 oz | as required |
| Differential copper etch | 0.5 / 2.0 oz | 0.5 / 2.0 oz |
| Maximum scoring depth | .093 in | .093 in |
| Jump score clearance | 300 mil | 300 mil |
| Minimum router cutter diameter | 31 mil | 31 mil |
| Electrical test voltage (min / max) | 10 / 500 V | 10 / 500 V |
| Electrical test resolution | 10 ohm @ 100 V | 10 ohm @ 100 V |
| Surface finishes: | ||
| OSP, HASL, ENIG, immersion silver, immersion tin, Pb free HASL | Y | Y |
| Materials: | ||
| Pb free process 370HR 180 Tg / Isola 404/8/10 180 Tg | Y | Y |
| Nanya FR4 140 Tg | Y | Y |
| Getek | Y | Y |
| Polyimide | Y | Y |
| Teflon (Rogers, Taconic, Arlon) | Y | Y |
| Rogers 4000 Series High Performance | Y | Y |
| Rogers 4000 Adhesive System | Y | Y |
| Nelco 4000/ -6, -13, -29 | Y | Y |
| Bergquist | Y | Y |
| Thermount RCC | Y | Y |
| Aramid | Y | Y |
| Special capabilities: | ||
| Laser drilling | Y | Y |
| Embedded passives | N | Y |
| Embedded resistors | N | Y |
| Conductive / non-conductive filled vias | Y | Y |
| Ink filled vias | Y | Y |
| Mixed dielectric constructions | Y | Y |
| Teflon multi-layers (fused) | Y | Y |
| Deep gold | Y | Y |
| Laser direct primary and soldermask imaging | N | Y |
| Counter sink / counter bore | Y | Y |
