AMERICAN PBC & PCBA EXPERTS
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Blog Posts
Blind, Buried and Filled Vias
This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each. Read more
Poor Hole Fill on Your Solder Joint?
A quality solder fill on the topside of your PCB is a reward achieved by properly combining the necessary ingredients of the soldering operation. Read more
Time-On-Joint for Selective Soldering
Time on Joint (TOJ) is not well documented in the literature for selective soldering. All solder operations require a minimum time for the tin-to-base metal intermetallic to properly form, and for the capillary action to pull the solder through the component hole. Read more
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