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Blog Posts

Blind, Buried and Filled Vias

This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each. Read more

Poor Hole Fill on Your Solder Joint?

A quality solder fill on the topside of your PCB is a reward achieved by properly combining the necessary ingredients of the soldering operation. Read more

Time-On-Joint for Selective Soldering

Time on Joint (TOJ) is not well documented in the literature for selective soldering. All solder operations require a minimum time for the tin-to-base metal intermetallic to properly form, and for the capillary action to pull the solder through the component hole. Read more

Workshops and Webinars

Advanced workshops on PCB & PCBA

Design To


June 16, 2021


August 25, 2020

What Impacts the Production Cost of PCB the Most


For the PCB and the Main PCBA Processes

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